| 摘要 |
PROBLEM TO BE SOLVED: To dissipate heat from an electronic component without using a component for dedicated use of dissipating heat. SOLUTION: An electronic circuit device includes a power supply bus bar 2 in which electric power is supplied from an external power source through a connector terminal 22, a mounting substrate 3 to which the power is supplied through the bus bar 2, and the electronic component 4 mounted on the substrate 3. The bus bar 2 is brought into contact with the surface of the electronic component 4. Thus, the heat generated by the component 4 is dissipated from the power supply bus bar 2, and also dissipated from a power supplying lead line connected with the connector terminal 22. COPYRIGHT: (C)2008,JPO&INPIT
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