| 摘要 |
PROBLEM TO BE SOLVED: To provide a new epoxy resin prepreg which can exhibit an extremely high flame-retardant effect without containing a flame retardant having an atom such as a halogen or phosphorus, to provide a laminate, and to provide a printed circuit board comprising the same. SOLUTION: The prepreg is characterized by impregnating a base material with a resin composition comprising an epoxy resin (A), a curing agent (B), a curing accelerator (C), a metal hydrate (D), and a silicone compound represented by an average composition formula (1): R<SP>1</SP><SB>m</SB>R<SP>2</SP><SB>n</SB>SiO<SB>(4-m-n)/2</SB>(1) [R<SP>1</SP>is a group selected from a group in which a carbon directly bound to the silicon atom is an aliphatic carbon, OH, and alkoxy groups; R<SP>2</SP>is a 6 to 24C aromatic hydrocarbon group; R<SP>1</SP>and R<SP>2</SP>are two or more kinds, respectively; (m) and (n) are the numbers satisfying 1.1≤(m)+(n)≤1.7, and 0.4≤(n)/(m)≤2.5]. COPYRIGHT: (C)2008,JPO&INPIT
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