发明名称 |
Electrically Conductive Connection, Electronic Component and Method for Their Production |
摘要 |
A connection structure includes a semiconductor die having a first major surface and an electrically conductive substrate having a second major surface. At least part of the second major surface is positioned facing towards and spaced at a distance from the first major surface. A galvanically deposited metallic layer extends between the first major surface and the second major surface and electrically connects the first major surface and the second major surface.
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申请公布号 |
US2007290337(A1) |
申请公布日期 |
2007.12.20 |
申请号 |
US20060424150 |
申请日期 |
2006.06.14 |
申请人 |
OTREMBA RALF;SCHLOEGEL XAVER;HOEGLAUER JOSEF;STECHER MATTHIAS |
发明人 |
OTREMBA RALF;SCHLOEGEL XAVER;HOEGLAUER JOSEF;STECHER MATTHIAS |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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