| 摘要 |
A semiconductor device includes a memory chip having a memory cell array including a plurality of memory blocks, wherein the memory chip includes a plurality of test pads for testing operations of the memory blocks, and an interface chip including a penetrating electrode and a plurality of interface circuit blocks, wherein at least one of the interface circuit blocks is electrically connected to at least one of the memory blocks via the penetrating electrode, and wherein the interface chip includes a plurality of bonding pads for interfacing between the interface circuit blocks and an external device.
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