发明名称 SEMICONDUCTOR STRUCTURE AND ITS TYPE, AND METHOD (STRUCTURE AND METHOD FOR FORMING MULTILAYER EMBEDDED STRESSOR)
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer embedded stressor which is used in a semiconductor structure causing deformation in a device channel area and has a gradual dopant distribution structure. <P>SOLUTION: This multilayer stressor is formed in a portion of a semiconductor structure where a source/drain area is generally positioned. This multilayer stressor comprises a first co-epitaxial semiconductor layer not doped or doped at a low concentration and a second epitaxial semiconductor layer doped at higher concentration than the first epitaxial semiconductor layer. Each of the first and second epitaxial layers has an identical lattice constant. The lattice constant differs from that of a substrate where each semiconductor layer is embedded. A structure including this multilayer embedded stressor ensures a good balance between an adjacent stress and a short channel effect and eliminates or substantially reduces any defects which generally occur during deeper source/drain area formation. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007329477(A) 申请公布日期 2007.12.20
申请号 JP20070148947 申请日期 2007.06.05
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 LUO ZHIJIONG;RICKY S AMOS;ROBEDO NIBO;UTOMO HENRY K
分类号 H01L29/78;H01L21/336;H01L21/8234;H01L21/8238;H01L27/088;H01L27/092;H01L29/786 主分类号 H01L29/78
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