摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device in which heat dissipation performance can be enhanced by supplying gas of low relative humidity to the liquid surface, thereby accelerating vaporization of refrigerant liquid. SOLUTION: The cooling device comprises a heating element 1, a heat receiving block 2 connected with the heating element 1, a gas channel 3 formed in the heat receiving block 2, a liquid supply path 4 formed in the heat receiving block 2 and supplying liquid to a heating surface 8 opposing the heating element in the gas channel, and a heat dissipation fin 5 formed at an upstream position for the heating surface 8 in the gas channel. COPYRIGHT: (C)2008,JPO&INPIT |