发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device in which heat dissipation performance can be enhanced by supplying gas of low relative humidity to the liquid surface, thereby accelerating vaporization of refrigerant liquid. SOLUTION: The cooling device comprises a heating element 1, a heat receiving block 2 connected with the heating element 1, a gas channel 3 formed in the heat receiving block 2, a liquid supply path 4 formed in the heat receiving block 2 and supplying liquid to a heating surface 8 opposing the heating element in the gas channel, and a heat dissipation fin 5 formed at an upstream position for the heating surface 8 in the gas channel. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329185(A) 申请公布日期 2007.12.20
申请号 JP20060157518 申请日期 2006.06.06
申请人 TOSHIBA CORP 发明人 KUNO KATSUMI;IWASAKI HIDEO;TAKAMATSU TOMONAO
分类号 H01L23/427;H05K7/20 主分类号 H01L23/427
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