发明名称 |
Metal-organic vaporizing and feeding apparatus, metal-organic chemical vapor deposition apparatus, metal-organic chemical vapor deposition method, gas flow rate regulator, semiconductor manufacturing apparatus, and semiconductor manufacturing method |
摘要 |
A metal-organic vaporizing and feeding apparatus includes: a retention vessel for retaining a metal-organic material; a bubbling gas feeding path connected to the retention vessel, for feeding bubbling gas to the metal-organic material; a metal-organic gas feeding path connected to the retention vessel, for feeding metal-organic gas generated in the retention vessel and dilution gas to a deposition chamber; a dilution gas feeding path connected to the metal-organic gas feeding path, for feeding the dilution gas to the metal-organic gas feeding path; a flow rate regulator provided in the bubbling gas feeding path, for regulating flow rate of the bubbling gas; a pressure regulator for regulating pressure of the dilution gas; and a sonic nozzle disposed in the metal-organic gas feeding path on a downstream side of a connecting position between the metal-organic gas feeding path and the dilution gas feeding path.
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申请公布号 |
US2007292612(A1) |
申请公布日期 |
2007.12.20 |
申请号 |
US20070808960 |
申请日期 |
2007.06.14 |
申请人 |
SOKEN INDUSTRIES |
发明人 |
UENO MASAKI;UEDA TOSHIO;NAKAMURA TAKAO;ISHIKAWA KOICHI;TAKAHASHI KEN;YASAKU OSAMU;UJIIE KAZUO;TAKEMOTO KIKUROU |
分类号 |
C23C16/00 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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