发明名称 RESIN, POSITIVE-TYPE RESIST COMPOSITION COMPRISING THE RESIN, PROTECTING FILM-FORMING COMPOSITION COMPRISING THE RESIN, PATTERN-FORMING METHOD USING THE POSITIVE-TYPE RESIST COMPOSITION, AND PATTERN-FORMING METHOD USING THE PROTECTING FILM-FORMING COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin suitably employable for a positive-type resist composition that is improved in defective development, and exhibits a good follow-up property to water and good line edge roughness on immersion exposure, a positive-type resist composition comprising the resin, a protecting film-forming composition comprising the resin, a pattern-forming method using the positive-type resist composition, and a pattern-forming method using the protecting film-forming composition. <P>SOLUTION: The resin has at least either one of a fluorine atom and a silicon atom, and a -CONHSO<SB>2</SB>- group. The positive-type resist composition comprises the resin. The protecting film-forming composition comprises the resin. The pattern-forming method comprises using the positive-type resist composition. The pattern-forming method comprises using the protecting film-forming composition. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007326903(A) 申请公布日期 2007.12.20
申请号 JP20060157226 申请日期 2006.06.06
申请人 FUJIFILM CORP 发明人 KANDA HIROMI
分类号 C08F20/54;G03F7/039;G03F7/11;H01L21/027 主分类号 C08F20/54
代理机构 代理人
主权项
地址