| 摘要 |
PROBLEM TO BE SOLVED: To improve heat resistance and transparency being problems of a conventional epoxy resin-acid anhydride curing system sealing agent useful for resin sealing of LED, etc. SOLUTION: The epoxy resin composition comprises a first component being at least one compound selected from silsesquioxane derivatives represented by formula (1), a second component being a cation polymerization initiator or an acid anhydride as essential components and a third component being at least one selected from a non-silicon based epoxy resin and a curing promoter as a component to be used, if necessary. COPYRIGHT: (C)2008,JPO&INPIT
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