发明名称 Curable Composition
摘要 A curable resin composition that forms a continuous phase and a dispersoid at normal temperatures, wherein the continuous phase is a liquid at normal temperatures and comprises (a) an epoxy compound having two or more epoxy groups in a molecule, and the dispersoid comprises (b) a compound present as solid particles in a continuous phase at normal temperatures and having two or more amino groups in a molecule (preferably, an aromatic amine compound having a benzoxazole structure). The present invention provides a one-component epoxy curable composition superior in the preservation stability and showing good properties of the cured product.
申请公布号 US2007293588(A1) 申请公布日期 2007.12.20
申请号 US20040583147 申请日期 2004.12.14
申请人 TOYO BOSEKI KABUSHIKI KAISHA 发明人 YOSHIDA TAKEFUMI;TSUTSUMI MASAYUKI;MAEDA SATOSHI;KAWAHARA KEIZO
分类号 B01F3/12;C08G59/50;C08G59/18 主分类号 B01F3/12
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