PACKAGE OF MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A MEMS package of device and a manufacturing method thereof are provided to increase the degree of freedom for interconnection layout by using bumps as bonding bumps, sealing lines and alignment bumps. A MEMS package comprises a cap wafer, and a plurality of bonding bumps formed on the cap wafer. A plurality of alignment bumps are formed at the outer sides of the bonding bumps. A wafer for a MEMS device has a plurality of first external pads corresponding to the alignment bumps. When the wafer is bonded to the cap wafer, the alignment bumps are bonded to the first external pads. Sealing lines are formed between the bonding bumps and the alignment bumps to surround the bonding bumps, wherein the bonding bumps and the sealing lines are formed on the same layer.