| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminate circuit board with high heat dissipation characteristics and high connection reliability, even in an arrangement where a heating element is mounted and a heat dissipation member formed with a metal material is disposed. <P>SOLUTION: In the laminate circuit board, a heat conductive member 2 formed with a material with higher heat conductivity than an insulating material constituting an insulating substrate 15 is disposed in the insulating substrate 15. On one end surface of the heat conductive member 2, a heating element 1 with a large amount of heat production is disposed on the heat conductive member 2 freely to transfer heat. On the other surface of the insulating substrate 15; a resin insulating layer 3, a first low elasticity resin layer 4, and a heat dissipation member 6 are disposed in this order and integrated. A heat conductivity of the resin insulating layer 3 is 2 W/mK or more. The first low elasticity resin layer 4 has a thickness of 20μm or more, and has tensile elasticity of 10 GPa in a temperature region at -40°C or higher by viscoelastic measurement. Further, the first low elasticity resin layer 4 is not disposed in a heating element mounting part corresponding region 5 and in this region 5 a protruded resin insulating layer is existent. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
