| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can shorten inspection time without increasing the degree of probe density, and to provide a method of inspecting a semiconductor integrated circuit. SOLUTION: A plurality of semiconductor integrated circuits 3 are formed in a wafer 2. The semiconductor device is provided with a plurality of inspection pads 4a which are formed on the outer periphery 2A of an effective area or on the outer periphery of reticle in the wafer 2, a power supply metal wiring 12, a metal wiring 15 for grounding, a metal wiring for output signal inspection, a metal wiring for control signal, and a metal wiring 14 for conroling switch element which respectively extends as a bus wiring along the semiconductor integrated circuits 3 from the inspection pads 4a, a coupling metal wiring to connect the bus wiring to each of the semiconductor integrated circuit 3, and a switch element which is formed on the coupling metal wiring 16 to select the semiconductor integrated circuit 3 to be inspected. COPYRIGHT: (C)2008,JPO&INPIT
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