| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which sufficient pressurization for preventing the wraparound of resin to a radiation face at the time of forming is realized without damaging a semiconductor element and reliability is improved. SOLUTION: A plurality of cylindrical spacers 9 are disposed in positions which are closed to the semiconductor element 2 and the semiconductor element 3, and which do not interfere with them between a lower heat sink 5 and an upper heat sink 8 which are arranged in parallel. The spacers 9 function as pressure reception parts (resistance parts) receiving mold-type clamping force (compression force) instead of the semiconductor elements 2 and 3 at the time of resin-molding the semiconductor elements 2 and 3, in a state where they are sandwiched between the lower and the upper heat sinks 5 and 8. Thus, damage of the semiconductor elements 2 and 3 is prevented and sufficient clamping force can be added. Consequently, wraparound of resin into both heat sinks 5 and 8 (requested to be exposed faces) can be prevented as much as possible. COPYRIGHT: (C)2005,JPO&NCIPI |
