发明名称 |
SUBMOUNT AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A submount with an electrode layer having excellent wettability in soldering and method of manufacturing the same are disclosed. A submount (1) for having a semiconductor device mounted thereon comprises a submount substrate (2), a substrate protective layer (3) formed on a surface of the submount substrate (2), an electrode layer (4) formed on the substrate protective layer (3) and a solder layer (5) formed on the electrode layer (3) wherein the electrode layer (4) is made having an average surface roughness of less than 1 µm. The reduced average surface roughness of the electrode layer (4) improves wettability of the solder layer (5), allowing the solder layer (5) and a semiconductor device to be firmly bonded together without any flux therebetween. A submount (1) is thus obtained which with the semiconductor device mounted thereon is reduced in heat resistance, reducing its temperature rise and improving its performance and service life.</p> |
申请公布号 |
EP1868241(A1) |
申请公布日期 |
2007.12.19 |
申请号 |
EP20060729450 |
申请日期 |
2006.03.17 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
OSHIKA, YOSHIKAZU;NAKANO, MASAYUKI |
分类号 |
H01L23/12;B23K35/30;H01L21/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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