发明名称 COOLING DEVICE FOR PRINTED CIRCUIT BOARDS AND METHOD FOR THE PRODUCTION THEREOF
摘要 Disclosed is a cooling device (1) for a printed circuit board (2) which is disposed in a housing (3) and can be connected in a locking manner to a metal cooling element (4) that is formed as a cover of said housing (3).
申请公布号 EP1867224(A2) 申请公布日期 2007.12.19
申请号 EP20060705989 申请日期 2006.02.18
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 SCHMIDT, JOSEF;WEICHSELBAUMER, PETER;RIESE, DIRK
分类号 H05K7/14;B60R16/023;H05K5/00;H05K7/20 主分类号 H05K7/14
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