| 摘要 |
<p>A semiconductor apparatus of the present invention includes: (i) a wire substrate having an insulating substrate in which a plurality of wire patterns are provided, (ii) a semiconductor element installed on the wire substrate with the insulating resin interposed therebetween, and a plurality of connecting terminals provided in the semiconductor element are electrically connected to connecting terminals of the wire patterns, respectively. In the semiconductor apparatus, the insulating substrate has mark patterns for alignment of the connecting terminals of the semiconductor element and the connecting terminals of the wire patterns, and an entire upper face of each of the mark patterns is covered with the insulating resin.</p> |
