发明名称 High-performance semi-conductor module with opposing electrically insulated terminals
摘要 <p>The module has a substrate (5), which comprises an insulating body and conductive strips (54) with load potential. Load-connection elements (40,42,44) are formed as metal molded articles with external contact devices (404,424,444) to a band section (422) and with internal contact devices (400,420). The internal contact devices reach to the substrate from the band section, and contact the substrate. The load connection elements are completely coated by an insulator (428) with exception of the area of the external and internal contact method, and electrically insulated against each other.</p>
申请公布号 EP1868243(A1) 申请公布日期 2007.12.19
申请号 EP20070011532 申请日期 2007.06.13
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 LEDERER, MARCO;POPP, RAINER
分类号 H01L25/07 主分类号 H01L25/07
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