Dielectric material and dielectric sintered body, and wiring board using the same

摘要

A dielectric material comprising: a glass powder constituted of a glass comprising Si, B and an alkali metal element, the glass being amorphous in sintering at a temperature of 1,050° C. or lower; and a ceramic filler comprising at least one member of SiO₂, Al₂O₃ and 3Al₂O₃.2SiO₂, and an alkali metal element, wherein when a total sum of Si converted into SiO₂, B converted into B₂O₃ and the alkali metal element converted into A₂O, wherein A represents an alkali metal element, all of which are contained in the glass, is 100 mole %, the content of the alkali metal element converted into A₂O, which is contained in the glass, is 0.5 mole % or less; and when a total sum of at least one member of SiO₂, Al₂O₃ and 3Al₂O₃.2SiO₂, and the alkali metal element converted into A₂O, all of which are contained in the ceramic filler, is 100 mole %, a content of the alkali metal element converted into A₂O, which is contained in the ceramic filler, is 0.5 mole % or less.