METHOD AND APPARATUS FOR CUTTING NON-METALLIC SUBSTRATE

摘要

A method and apparatus for cutting a nonmetallic substrate capable of reducing steps and time for cutting a nonmetallic substrate and contaminants of the substrate. An initial crack is previously formed on a nonmetallic substrate by applying laser beams and coolant on the nonmetallic substrate and a scribe crack is formed on the nonmetallic substrate by applying the laser beams to the initial crack. The nonmetallic substrate is cut along the scribe crack by rapidly heating and cooling the portion of the scribe crack using the laser beams and coolant.