发明名称 Heat dissipating device
摘要 A heat dissipating device of the present invention includes a heat sink ( 20 ) and two locking devices ( 10 ) for securing the heat sink. The heat sink includes a base ( 22 ) for contacting an electronic component. Each locking device includes a spring member, a post ( 12 ) and a sleeve ( 18 ). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.
申请公布号 US7310229(B2) 申请公布日期 2007.12.18
申请号 US20050065387 申请日期 2005.02.24
申请人 FU ZHUN PRECISION INDUSTRY (SHENZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 LEE HSIEH-KUN;XIA WAN-LIN;CHEN BAO-CHUN
分类号 H05K7/20;G06F1/20;H01L23/34;H01L23/40 主分类号 H05K7/20
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