| 摘要 |
<p>A flexible printed wiring board and a semiconductor apparatus are provided to prevent a wiring formed on a bent part from being ruptured even though the board is used to be bent, and to determine a board location by sensing a pattern of light transmitting the board. A flexible printed wiring board has a wiring pattern formed by etching an electrolytic copper foil layer of a base film with a polyimide layer formed on a surface of the electrolytic copper foil layer selectively. The flexible printed wiring board uses the wiring pattern by bending the wiring pattern and the polyimide layer together. The wiring pattern includes a copper crystal particle with a column shape of which a major axis has a length of above 3 um. The wiring pattern is made of the electrolytic copper foil with thickness below 15 um and the coefficient of expansion above 5% in 25 degrees centigrade.</p> |
