Use of overlay diagnostics for enhanced automatic process control

摘要

Disclosed are apparatus and methods for obtaining and analyzing various unique metrics or "target diagnostics" from one or more semiconductor overlay targets. In one embodiment, an overlay target is measured to obtain one or both of two specific types of target diagnostic information, systematic error metrics and/or random noise metrics. The systematic error metrics generally quantify asymmetries of the overlay target, while the random noise metrics quantify and/or qualify the spatial noise that is proximate to or associated with the overlay target.