PRINTED CIRCUIT BOARD WITH HIGH BOND STRENGTH OF SOLDER BALL AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board with high bond strength of a solder ball and a method for manufacturing the same are provided to minimize warp and obtain high surface smoothness, high insulation reliability of an outer layer circuit, and heat resistance after moisture absorption by reducing non-uniformity of thickness in a solder resist. A printed circuit board with high bond strength of a solder ball includes a printed circuit board, a solder resist layer(106), a solder ball junction auxiliary land(105), and a solder ball(109). The printed circuit board has a circuit pattern with a solder ball land. The solder resist layer is formed on the printed circuit board and has a blind via hole for exposing the solder ball land. The solder ball junction auxiliary land is formed on the solder resist layer on both side upper parts of the blind via hole. The solder ball is mounted to the solder ball land and the solder ball junction auxiliary land.