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发明名称
多电路模组结构
摘要
一种多电路模组结构,包含多个电路模组板以及多个电性连接件,其中每一个电路模组板各具有不同独立的介面功能,而电性连接件则连接二电路模组板,以堆叠或并排的方式将多个电路模组板逐一连接,形成完整的电路模组结构。
申请公布号
TW200746385
申请公布日期
2007.12.16
申请号
TW095120088
申请日期
2006.06.06
申请人
龙骏国际科技股份有限公司
发明人
林腾彰
分类号
H01L25/10(2006.01);H01L23/28(2006.01)
主分类号
H01L25/10(2006.01)
代理机构
代理人
蔡坤财
主权项
地址
台北县新店市民权路100号10楼
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