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发明名称
挠性印刷配线板及其制法
摘要
本发明系有关使用由以作为二胺成分之对苯二胺及4,4’-二胺基二苯醚、作为酸二酐成分之均苯四甲酸二酐及3,3’,4,4’-联苯基四羧酸二酐作为主成分所成的聚醯亚胺薄膜,在该聚醯亚胺薄膜之一面或两面上经由黏合剂、或没有经由黏合剂下配线的挠性印刷配线板,由于可形成微细的配线,且即使使用无铅焊接仍不会有变形情形,故最适合作为挠性印刷配线板。
申请公布号
TW200746936
申请公布日期
2007.12.16
申请号
TW095147027
申请日期
2006.12.15
申请人
东丽杜邦股份有限公司
发明人
小国昌宏;前田周;泽崎孔一
分类号
H05K1/03(2006.01);B32B15/088(2006.01)
主分类号
H05K1/03(2006.01)
代理机构
代理人
何金涂;何秋远
主权项
地址
日本
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