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发明名称
焊接安装构造之制造方法及制造装置
摘要
本发明于相机模组构造(100)之制造中,一面自热风喷嘴(4)喷出热风使焊接部(3)之焊剂熔融,一面自比热风喷嘴(4)之配置位置靠相机模组(2)之侧,藉由吸嘴(5)而抽吸对流至相机模组(2)侧之热风。藉此,可制造一种焊接安装构造,其安装于布线基板上而不会因热而损伤不耐热之电子零件。
申请公布号
TW200746966
申请公布日期
2007.12.16
申请号
TW096103599
申请日期
2007.01.31
申请人
夏普股份有限公司
发明人
木下一生;西田胜逸
分类号
H05K3/34(2006.01);B23K1/00(2006.01);B23K1/012(2006.01);B23K3/04(2006.01)
主分类号
H05K3/34(2006.01)
代理机构
代理人
陈长文;林宗宏
主权项
地址
日本
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