发明名称 SILICONE-BASED ADHESIVE COMPOSITION, METHOD FOR SURFACE TREATMENT OF SUBSTRATE AND METHOD FOR FORMING FINE PATTERNS USING THE SAME
摘要 A silicone-based adhesive composition, a method for treating the surface of a substrate by using the composition for forming a circuit wiring, a method forming a micropattern by using the surface-treated substrate, and a circuit board containing the micropattern are provided to improve the adhesion of wiring and the spreading of an ink and to lower the surface energy of a substrate. A silicone-based adhesive composition comprises 55-65 parts by weight of a vinyl polysiloxane-based silicone polymer; 30-45 parts by weight of a polydimethyl siloxane-based silicone adhesive; 4-8 parts by weight of a hydrogen polysiloxane-based resin; and 0.1-2 parts by weight of a platinum catalyst. Preferably the vinyl polysiloxane-based silicone polymer is represented by the formula 1 (wherein n is an integer of 100-1,000); and the polydimethyl siloxane-based silicone adhesive is represented by the formula 2 (wherein n is an integer of 5,000-140,000).
申请公布号 KR100783471(B1) 申请公布日期 2007.12.07
申请号 KR20060085237 申请日期 2006.09.05
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, JIN SEON;JOUNG, JAE WOO;JUNG, HYUN CHUL;CHO, SU HWAN
分类号 C09J183/04;C09J183/00 主分类号 C09J183/04
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