PRINTED CIRCUIT BOARD HAVING EMBEDDED CHIP AND MANUFACTURING METHOD THEREFORE

摘要

A printed circuit board having an embedded chip and a method for manufacturing the same are provided to solve a residual stress or a crack of the chip, and to reduce a difference between a thickness of an insulation layer on the chip and a thickness of an insulation layer of a pattern in the vicinity of the chip. A printed circuit board having an embedded chip includes a core layer(10), a chip(19), an upper insulation layer and a lower insulation layer, and a circuit layer. The core layer has a cavity. The chip is fixed to an inner portion of the cavity by a conductive material. The conductive material is formed by copper plating. The chip is equipped with a chip pad(21) and a periphery unit(22) formed in the circumference of the chip pad. The periphery unit is higher than the chip pad. The upper insulation layer and the lower insulation layer are laminated on both surfaces of the core layer. The circuit layer is laminated on the upper insulation layer and the lower insulation layer, and is electrically connected to the chip pad. The upper and the lower insulation layers have the same expansion coefficient as the insulation layers included in the core layer.