| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting apparatus having improved mounting efficiency by enabling transfer of a large number of electronic components from a component feeder to a substrate without increasing the size of a head unit or executing complicated control. <P>SOLUTION: The surface mounting apparatus includes a conveying device for conveying a printed wiring board in an X direction on a pedestal; an electronic component feeding device having many feeders; and an X-direction moving member having a supporting member 32 extending in a Y-direction, and moving in the X-direction on the pedestal. The apparatus includes a head unit 24 provided with a plurality of suction heads 55 each having a suction nozzle 36, and supported by the supporting member 32 to move in the Y-direction. The plurality of suction heads 55 provided on the head unit 24 are composed of a head row consisting of the plurality of suction heads 55 juxtaposed in the X-direction. <P>COPYRIGHT: (C)2008,JPO&INPIT |
