发明名称 SUBSTRATE TRANSFER APPARATUS AND ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate transfer apparatus and an electronic component mounting apparatus which can secure a large movable width of a pair of transfer rails for the transfer of a substrate. <P>SOLUTION: The substrate transfer apparatus comprises a pair of transfer rails 4, 5 for transferring a substrate 6, with its both sides supported thereby; a ball screw 20 journalled in both side of the pair of transfer rails 4, 5; and a nut 23 threadably receiving the ball screw 20, to be selectively mounted on any of the pair of transfer rails 4, 5, and to be positioned inside of the outer ends of the transfer rails 4, 5. The pair of transfer rails 4, 5 are arranged to, be moved away from each other and toward each other, when the ball screw 20 is rotatably driven. Even when any of the transfer rails 4, 5 is selected as a reference rail, the nut 23 is positioned inside of the outer ends of the transfer rails 4, 5. Consequently, a movable width for the nut larger than the movable width of the transfer rails 4, 5 can be secured. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007317911(A) 申请公布日期 2007.12.06
申请号 JP20060146412 申请日期 2006.05.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OTA HIROSHI;NAKAI NOBUHIRO
分类号 H05K13/02 主分类号 H05K13/02
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