| 摘要 |
PROBLEM TO BE SOLVED: To provide a new and advanced semiconductor material handling system which is improved in cleanliness and workability and can be reduced in footprint. SOLUTION: In the semiconductor material handling system, a wafer transfer robot 1000 includes: a robot body 100 which is placed in a frame and includes an elevating member moving up and down along a predetermined elevating axis; a joint arm 200 made of a driving link and a plurality of driven links, the driving link attached to the elevating member, the driven link having an end linearly moving in the horizontal direction along a frame surface on which a load port is attached; a swing unit 300 rotating about the vertical axis of rotation; and an intersecting arm 400 including a base attached to the swing unit, a plurality of sliding units attached to the base so as to linearly reciprocate in the horizontal direction, and a wafer hand for pulling out and storing a wafer from and into a wafer cassette. COPYRIGHT: (C)2008,JPO&INPIT
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