FLEXIBLE SUBSTRATE, SOLDER RESIST COMPOSITION THEREFOR, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a solder resist composition for flexible substrates which cracks hardly and can maintain its flexibility, even though the filling factor of its filler is increased for increasing its thermal conductivity. SOLUTION: The solder resist composition for flexible substrates contains: a hydrogenation biphenyl epoxy resin (A); a rubber-form compound (B) having a functional group which reacts to an epoxy group; and aluminum oxide particles (C). COPYRIGHT: (C)2008,JPO&INPIT