| 摘要 |
PROBLEM TO BE SOLVED: To achieve a novel fixing structure of electronic device for mounting an electronic device on a heat plate in which heat dissipation properties can be enhanced while exhibiting adhesive properties between the electronic device and the heat plate. SOLUTION: In the fixing structure of electronic device, an electronic device 10 is mounted on one surface 21 of a heat plate 20, and bonded through adhesive 30. A fine split 22 is provided on one surface 21 of the heat plate 20 and located in the adhesive 30 under such a state that the tip side end of the fine split 22 touches the electronic device 10. COPYRIGHT: (C)2008,JPO&INPIT
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