| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be prevented from an electrical failure caused by the destruction of a solder joint between a land terminal located immediately below an external corner of a semiconductor element and a solder ball, due to stress caused by a difference in thermal expansion under such a state that the land terminals are connected to a circuit board of an electronic apparatus via the solder balls. SOLUTION: The semiconductor element 2 is mounted on one face of an interposer wiring board 3. On the other face of the interposer wiring board 3, solder lands 9 are formed except for the land terminals 10 located immediately below the external corners C of the four corners of the semiconductor element 2. Each solder land 9 consists of the land terminal 10, and the solder ball 11 formed on the surface of the land terminal 10. Due to this structure wherein solder balls are not formed on the land terminals 10 located immediately below the external corners where stress becomes extremely high, the time to failure in the solder joints of the semiconductor device can be extended. COPYRIGHT: (C)2008,JPO&INPIT
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