APPARATUS FOR MANUFACTURING SEMICONDUCTOR

摘要

An apparatus for manufacturing a semiconductor is provided to prevent wafer damage and generation of particles by using a curved-shape guide. An ion implantation process is performed on a process chamber(150). An electrostatic chuck platen(140) vertically loads a wafer that is treated in the process chamber. A load lock stores plural wafers. A wafer transfer robot transfers the wafer between the electrostatic chuck and the load lock. A curved-shape guide(160) is arranged in the proximity of the electrostatic chuck to receive a dropping wafer released from the electrostatic chuck. The guide includes a first part, a second part, and a third part. The first part is extended downwardly. The second part is separated from the first part to be contacted to the surface of the dropping wafer from the electrostatic chuck. The second part is extended upwardly. The third unit connects to the first and the second parts and has a curvature contacting to an edge of the wafer.