发明名称 WOOD FLOORING AND MANUFACTURING PROCESS THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a wood flooring which does not cause a big gap in a joint part between adjoining wood flooring even when used as a floor for floor heating. SOLUTION: A lot of slits 4 are formed in the wood fiberboard 3 penetrating through the wood fiberboard 3 to the surface of wood substrate 1 in a wood flooring 10, in which the wood fiberboard 3 is pasted on the surface side of the wood substrate 1 and a surface decorative material 5 is pasted on the wood fiberboard 3. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007313874(A) 申请公布日期 2007.12.06
申请号 JP20060174306 申请日期 2006.06.23
申请人 EIDAI CO LTD 发明人 MURAKAMI KAICHIRO
分类号 B27M3/04;B27M3/00;E04F15/04 主分类号 B27M3/04
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