Disclosed is an arrangement in which the inner walls of the holes of a printed circuit board are incorporated into the electromagnetic shield in order to allow heat exchanging media to penetrate therethrough.
申请公布号
WO2007101800(A3)
申请公布日期
2007.12.06
申请号
WO2007EP51801
申请日期
2007.02.26
申请人
SIEMENS AKTIENGESELLSCHAFT;SEDLMEIER, PETER;ZETTELMEIER, KARL
