SEMICONDUCTOR PACKAGE AND THE MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and a manufacturing method thereof are provided to decrease the thickness of a stack semiconductor package by reducing a gap between a first and a second semiconductor dies. A first semiconductor die(110) comprises a first flat plane(111) and a second flat plane(112), wherein at least one bond pad(113,123) is formed on the second flat plane. The first semiconductor die is adhered to a substrate(130). Adhesives(140,150) are mounted on the second flat plane. At least one first conductive wire(160) is comprised, of which one end is connected to the bond pad through the adhesives, and the other end is connected to the substrate. An encapsulant(180) encapsulates the first semiconductor die, the substrate and the first conductive wire.