| 摘要 |
A heat pipe module for cooling devices is provided to increase a heat exchange area by using a plurality of manifolds consisting of capillary pipes without the need of a cold storage material and additional devices concerned with phase change of refrigerant. A heat pipe module for cooling devices comprises a heat pipe, a plurality of thermoelectric modules(20), a heat sink(30), and a heat dissipating fan(40). The heat pipe comprises one or more pipes(11) made with manifolds(14) divided into many capillary pipes, a first header(12) having a space(12a) in communication with an end portion of the pipe and at least a plane(12b) on its one side, and a second header(13) having a space in communication with the other end portion of the pipe. The thermoelectric module has a cooling side in contact with the plane of the first header of the heat pipe. The heat sink is in contact with a heat dissipating side of the thermoelectric module, having a plurality of heat dissipating fins(32) on the back side in parallel.
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