| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated device by which damages to a semiconductor laser chip by static electricity can be prevented, when a device using the semiconductor chip is assembled. <P>SOLUTION: The integrated device includes the semiconductor laser chip 24; a first lead 26-3 which is electrically connected with a live part side of the semiconductor laser chip 24; a second lead 26-1 which is electrically connected with the ground side of the semiconductor laser chip 24; and the body 30 which supports the semiconductor laser chip 24, the first lead 26-3, and the second lead 26-1 and exhibits insulation properties. The body 30 has a capacitor 28, which is set between the first lead 26-3 and the second lead 26-1 and a storage 52 where at least a part of the capacitor is stored. <P>COPYRIGHT: (C)2008,JPO&INPIT |
