| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate supporting method and a method for manufacturing a semiconductor device, wherein a substrate can be appropriately supported without using an adhesive that is required to have a temporary fixing property and a debonding property, and a support substrate can be properly removed. <P>SOLUTION: A support substrate 29 is bonded to a semiconductor chip (processing substrate) 20A by a fusion bonding via a bonding bump 27 formed on the semiconductor chip 20A, and also the support substrate 29 is removed by polishing the support substrate 29. Thus, an adhesive having the temporary fixing property and the debonding property which have been conventionally required is unwanted, and a processing step can be executed for the semiconductor chip 20A without being under restriction of a heat-resistant temperature or chemical resistance of the adhesive. It becomes possible to form an insulating film excellent in an adhesion or to perform a stable pattern processing of a terminal face, for instance. <P>COPYRIGHT: (C)2008,JPO&INPIT |
