THERMALLY CROSS-LINKING TYPE CIRCUIT-CONNECTING MATERIAL AND METHOD FOR PRODUCING CIRCUIT BOARD BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thermally cross-linking type circuit-connecting material having small deterioration in its characteristics after leaving it at room temperature and capable of providing good connection; and a method for producing a circuit board by using the same. SOLUTION: This thermally cross-linking type circuit connecting material being positioned between opposing circuit electrodes and electrically connecting the electrodes by pressurizing the opposing electrodes in the pressurizing direction contains essentially the following constituents (1) to (3). (1) A curing agent which generates free radicals by heating and is solid at a temperature below 40°C, and of which the temperature of the half life of 10 hours is above 100°C and that of the half life of 1 min is below 200°C, (2) a radically polymerizable material, and (3) a film formation component. COPYRIGHT: (C)2008,JPO&INPIT