| 摘要 |
A bake apparatus is provided to increase a processing speed and efficiency and to reduce an installation cost by directly transporting a substrate from a substrate cooling part to a buffer without a conveyor. A bake apparatus includes a substrate heating part(100), a substrate cooling part(200), and a first substrate transporting robot(400). The first substrate transporting robot inputs a substrate into the substrate heating part and/or the substrate cooling part and gets back the substrate. The substrate heating part, the first transporting robot, and the substrate cooling part are arranged in a shape of L. |
