APPARATUS WITH FILLET RADIUS JOINTS

摘要

An apparatus with fillet radius joints for holding semiconductor wafers is provided to join the components of the apparatus by joints having flanges with a fillet radius, and to keep the stability of the joints in manual operation as well as the harsh conditions of semiconductor wafer processing chambers. An apparatus with fillet radius joints for holding semiconductor wafers comprises a plurality of rods(30) which are joined to the ends opposite to respective endplates(40) by joints(20) having arc-shaped flanges(10) with a fillet radius(r), wherein the joints are coated with silicon carbide. Each rod end has a tenon which is inserted into the inside of the respective endplate through an elliptical port having the flange with the fillet radius around its circumference. Each tenon is continuous with a shoulder of the rod at each end of the rod, wherein each shoulder has a flat surface contacting with the top surface of the flange to form a contact surface between the flat surface of the shoulder and the top surface of the flange.