POLYIMIDE ROLL FILM, COPPER-CLAD LAMINATE, CIRCUIT BOARD AND METHOD FOR PRODUCING POLYIMIDE ROLL FILM

摘要

PROBLEM TO BE SOLVED: To obtain a polyimide film that is useful as a substrate film of copper-clad laminate substrate (copper-clad laminate film) for a circuit board, has a small amount of foreign matter attached to a surface, is thin and has a high tensile modulus. SOLUTION: The polyimide roll film has an attached amount of foreign matters having≥2μm size of 100-100,000/m2, film thickness of 2-12.5μm and a tensile modulus of≥6 GPa. Especially the polyimide roll film comprises a polyimide containing a benzoxazole backbone as the residue of an aromatic diamine. COPYRIGHT: (C)2008,JPO&INPIT