| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which can reduce occurrence of warp, and to provide a semiconductor device using the substrate. SOLUTION: A substrate 3 has a build-up layer wherein an insulating layer comprising resin and a conductor wiring layer 312 are laminated alternately and each conductor wiring layer 312 is connected by a conductor layer formed in the via hole of the insulation layer. A conductor wiring layer 312D disposed in a substrate outermost side of the conductor wiring layer 312 is formed in a signal wiring arrangement area A, and has a plurality of signal lines 312D1 extended in a prescribed direction. When a linear expansion coefficient is specified as (αsig-x) measured by a laser speckle method in an almost parallel direction of the signal line 312D1 of the signal line arrangement area A wherein the signal line 312D1 is disposed, and a linear expansion coefficient is specified as (αsig-y) by the speckle method in an almost orthogonal direction to the signal line 312D1, signal line direction dependency of a linear expansion coefficient ((αsig-y-αsig-x)/αsig-x)×100 is 25 or less. COPYRIGHT: (C)2008,JPO&INPIT |
