发明名称 |
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOARD, AND PRODUCUTION METHOD THEREOF |
摘要 |
A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 mum or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
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申请公布号 |
US2007277373(A1) |
申请公布日期 |
2007.12.06 |
申请号 |
US20070836927 |
申请日期 |
2007.08.10 |
申请人 |
TAKAI KENJI;MORIIKE NORIO;KAMIYAMA KENICHI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI |
发明人 |
TAKAI KENJI;MORIIKE NORIO;KAMIYAMA KENICHI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI |
分类号 |
H05K3/00;H05K3/18;C23C18/12;H05K3/10;H05K3/24;H05K3/38;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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