| 摘要 |
A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically conductive pads; forming on the circuit board an insulating protection layer having a plurality of openings for exposing the first and second electrically conductive pads; forming a metal adhesive layer on the first and second electrically conductive pads; forming a conductive layer on the insulating protection layer and on the metal adhesive layer formed on the first and second electrically conductive pads, the conductive layer being electrical conductive to the first and second electrically conductive pads; forming on the conductive layer a resist layer having a plurality of openings for exposing the conductive layer on the second electrically conductive pads; and electroplating a conductive structure on the conductive layer on the second electrically conductive pads exposed from the openings.
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