| 摘要 |
An apparatus of bonding a camera module and an F-PCB is provided to improve a fabricating process of a camera by attaching the camera module and F-PCB using a pulse heat scheme. An apparatus of bonding a camera module and an F-PCB(Flexible-Printed Circuit Board) using a pulse heat scheme includes a bonding head(11), a heat tip(12), and a base(13). The bonding head is movably formed at a bottom of a driving unit(18), which is positioned on an upper portion of a supporting member(20). The heat tip having a thermocouple connected to a pulse heat power generator(19) is formed at a lower portion of the bonding head. The base includes a fixing hole(14) for fixing movably the camera module and a fixing unit(15) for fixing the F-PCB(17) in a lower portion of the heat tip.
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